Solving the Dilemma of Small Parts Handling

Friday, March 3, 2017

Trends in semiconductor packaging are being driven by the need for higher density (higher pin count), smaller and thinner ICs to support small form factor products. Wafer Level Chip-Scale Packing (WLCSP) is primed to dominate the internet of things (IoT) industry, provided IoT manufacturers find reasonable solutions to safely handle and program their devices. Manufacturers are looking to preprogram small form factor ICs and bake in security at the same time rather than bolting it on as an afterthought. Advancements in robotics handling, socketing technologies and embedded security software are paving the way for new offline automated programming solutions specifically designed for handling and securing small parts.

Download Data I/O's whitepaper on best practices for pre-programming WLCSP devices:

Whitepaper:
Solving the Dilemma of Small Parts Handling

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Data I/O Corporation (NASDAQ: DAIO) is the leading global provider of advanced data and security programming solutions for flash, flash-memory based intelligent devices and microcontrollers for automotive, Internet-of-Things, medical, wireless, consumer electronics, industrial controls and other markets.   Customers use Data I/O’s programming solutions to reliably, securely, and cost-effectively bring innovative new products to life.

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